Organic light emitting diode display device

ABSTRACT

An organic light emitting diode display device includes a display panel including an array substrate displaying an image, a face sealing adhesive layer attached to the array substrate, a side sealing layer covering a side surface of the array substrate, and a protecting substrate attached to the array substrate through the face sealing adhesive layer; and a printed circuit board attached to the protecting substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the priority benefit of Korean PatentApplication No. 10-2018-0104613 filed in the Republic of Korea on Sep.3, 2018 and Korean Patent application No. 10-2019-0094197 filed in theRepublic of Korea on Aug. 2, 2019, all of these applications are herebyincorporated by reference in their entirety for all purposes as if fullyset forth herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an organic light emitting diode displaydevice, and more particularly, to an organic light emitting diodedisplay device including a display panel having a protecting substrate.

Discussion of the Related Art

Recently, a flat panel display (FPD) having a thin profile, a lightweight and a low power consumption has been developed and applied tovarious fields.

In an organic light emitting diode (OLED) display device among flatpanel displays, charges are injected into a light emitting layer betweena cathode of an electron injecting electrode and an anode of a holeinjecting electrode to form an exciton, and the exciton transitions froman excited state to a ground state to emit a light.

A set apparatus including an OLED display device as a finished productmay be used for a television, a monitor of a computer and a billboard.The set apparatus of the OLED display device includes a plurality offrames supporting and accommodating a display panel. To constitute anexterior of the set apparatus of the OLED display device and to protectthe display panel, the plurality of frames are required to have apredetermined rigidity. In addition, the plurality of frames arerequired to have a function of radiating heat generated from the displaypanel or a control circuit to the outside of the OLED display device.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an organic lightemitting diode display device that substantially obviates one or more ofthe problems due to limitations and disadvantages of the related art.

An object of the present invention is to provide an organic lightemitting diode display device where a printed circuit board is directlyattached to a protecting substrate having a relatively great rigidity.

Another object of the present invention is to provide an organic lightemitting diode display device where a protecting substrate has arelatively great rigidity and includes a pattern layer.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or can be learned by practice of the invention. These andother advantages of the invention will be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described herein, anorganic light emitting diode display device includes a display panelincluding an array substrate displaying an image, a face sealingadhesive layer attached to the array substrate, a side sealing layercovering a side surface of the array substrate, and a protectingsubstrate attached to the array substrate through the face sealingadhesive layer; and a printed circuit board attached to the protectingsubstrate.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention. In the drawings:

FIG. 1 is an exploded perspective view showing an organic light emittingdiode display device according to a first embodiment of the presentdisclosure;

FIG. 2 is a cross-sectional view showing the organic light emittingdiode display device according to the first embodiment of the presentdisclosure;

FIG. 3A is an exploded perspective view showing an inner plate, a coverbottom and a printed circuit board of the organic light emitting diodedisplay device according to the first embodiment of the presentdisclosure

FIG. 3B is a cross-sectional view showing the inner plate, the coverbottom and the printed circuit board of the organic light emitting diodedisplay device according to the first embodiment of the presentdisclosure;

FIG. 4 is an exploded perspective view showing an organic light emittingdiode display device according to a second embodiment of the presentdisclosure;

FIG. 5 is a cross-sectional view showing the organic light emittingdiode display device according to the second embodiment of the presentdisclosure;

FIG. 6A is an exploded perspective view showing a protecting substrateand a printed circuit board of the organic light emitting diode displaydevice according to the second embodiment of the present disclosure;

FIG. 6B is a cross-sectional view, respectively, showing the protectingsubstrate and the printed circuit board of the organic light emittingdiode display device according to the second embodiment of the presentdisclosure;

FIG. 7 is an exploded perspective view showing an organic light emittingdiode display device according to a third embodiment of the presentdisclosure;

FIG. 8 is a cross-sectional view showing the organic light emittingdiode display device according the a third embodiment of the presentdisclosure;

FIG. 9A is an exploded perspective view showing a protecting substrateand a printed circuit board of the organic light emitting diode displaydevice according to the third embodiment of the present disclosure;

FIG. 9B is a cross-sectional view showing the protecting substrate andthe printed circuit board of the organic light emitting diode displaydevice according the a third embodiment of the present disclosure; and

FIG. 10 is a cross-sectional view showing a display panel of the organiclight emitting diode display device according to the third embodiment ofthe present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to embodiments of the presentdisclosure, examples of which can be illustrated in the accompanyingdrawings. In the following description, when a detailed description ofwell-known functions or configurations related to this document isdetermined to unnecessarily cloud a gist of the inventive concept, thedetailed description thereof will be omitted. The progression ofprocessing steps and/or operations described is an example; however, thesequence of steps and/or operations is not limited to that set forthherein and can be changed as is known in the art, with the exception ofsteps and/or operations necessarily occurring in a particular order.Like reference numerals designate like elements throughout. Names of therespective elements used in the following explanations are selected onlyfor convenience of writing the specification and can be thus differentfrom those used in actual products.

Advantages and features of the present disclosure, and implementationmethods thereof will be clarified through following example embodimentsdescribed with reference to the accompanying drawings. The presentdisclosure may, however, be embodied in different forms and should notbe construed as limited to the example embodiments set forth herein.Rather, these example embodiments are provided so that this disclosurecan be sufficiently thorough and complete to assist those skilled in theart to fully understand the scope of the present disclosure. Further,the present disclosure is only defined by scopes of claims.

A shape, a size, a ratio, an angle, and a number disclosed in thedrawings for describing embodiments of the present disclosure are merelyan example. Thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout. In the following description, when the detailed descriptionof the relevant known function or configuration is determined tounnecessarily obscure an important point of the present disclosure, thedetailed description of such known function or configuration can beomitted. In a case where terms “comprise,” “have,” and “include”described in the present specification are used, another part can beadded unless a more limiting term, such as “only,” is used. The terms ofa singular form can include plural forms unless referred to thecontrary.

In construing an element, the element is construed as including an erroror tolerance range even where no explicit description of such an erroror tolerance range. In describing a position relationship, when aposition relation between two parts is described as, for example, “on,”“over,” “under,” or “next,” one or more other parts can be disposedbetween the two parts unless a more limiting term, such as “just” or“direct(ly),” is used.

In describing a time relationship, when the temporal order is describedas, for example, “after,” “subsequent,” “next,” or “before,” a casewhich is not continuous can be included unless a more limiting term,such as “just,” “immediate(ly),” or “direct(ly),” is used.

It will be understood that, although the terms “first,” “second,” etc.can be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

In describing elements of the present disclosure, the terms like“first,” “second,” “A,” “B,” “(a),” and “(b)” can be used. These termsare merely for differentiating one element from another element, and theessence, sequence, order, or number of a corresponding element shouldnot be limited by the terms. Also, when an element or layer is describedas being “connected,” “coupled,” or “adhered” to another element orlayer, the element or layer can not only be directly connected oradhered to that other element or layer, but also be indirectly connectedor adhered to the other element or layer with one or more interveningelements or layers “disposed” between the elements or layers, unlessotherwise specified.

The term “at least one” should be understood as including any and allcombinations of one or more of the associated listed items. For example,the meaning of “at least one of a first item, a second item, and a thirditem” denotes the combination of all items proposed from two or more ofthe first item, the second item, and the third item as well as the firstitem, the second item, or the third item.

In the description of embodiments, when a structure is described asbeing positioned “on or above” or “under or below” another structure,this description should be construed as including a case in which thestructures contact each other as well as a case in which a thirdstructure is disposed therebetween. The size and thickness of eachelement shown in the drawings are given merely for the convenience ofdescription, and embodiments of the present disclosure are not limitedthereto.

Features of various embodiments of the present disclosure can bepartially or overall coupled to or combined with each other, and can bevariously inter-operated with each other and driven technically as thoseskilled in the art can sufficiently understand. Embodiments of thepresent disclosure can be carried out independently from each other, orcan be carried out together in co-dependent relationship.

Reference will now be made in detail to the present disclosure, examplesof which are illustrated in the accompanying drawings.

FIG. 1 is an exploded perspective view showing an organic light emittingdiode display device according to a first embodiment of the presentdisclosure, and FIG. 2 is a cross-sectional view showing the organiclight emitting diode display device according to the first embodiment ofthe present disclosure. All the components of the organic light emittingdiode display device according to all embodiments of the presentdisclosure are operatively coupled and configured.

In FIGS. 1 and 2, an organic light emitting diode (OLED) display device110 according to the first embodiment of the present disclosure includesa display panel 120, an inner plate 140, a middle cabinet 150, a coverbottom 160 and a printed circuit board (PCB) 170.

The display panel 120 includes an array substrate 122, a polarizingplate 124, a side sealing layer 126, a face sealing adhesive layer 128and a face sealing metal layer 130.

The array substrate 122 displays an image using a gate signal and a datasignal, and the polarizing plate 124 prevents reflection of an externallight.

The polarizing plate 124 has a size greater than a size of the arraysubstrate 122 and is attached to a first surface of the array substrate122. The side sealing layer 126 covers a side surface of the arraysubstrate 122 and a portion of the polarizing plate 124 exposed throughthe side surface of the array substrate 122 to block a moisture or anoxygen of an exterior penetrating into the array substrate 122.

The face sealing adhesive layer 128 is attached to a second surface ofthe array substrate 122, and the face sealing metal layer 130 isattached to the face sealing adhesive layer 128. The face sealingadhesive layer 128 and the face sealing metal layer 130 block anexternal moisture or an external oxygen penetrating into the arraysubstrate 122, and the face sealing metal layer 130 maintains a rigidityof the array substrate 122.

For example, the face sealing metal layer 130 can include a metallicmaterial. The face sealing metal layer 130 can have a thickness of about0.08 mm, a Young's modulus of about 148 GPa, a density of about 0.29 1lb/in³ and a thermal conductivity of about 10.15 W/mK.

The inner plate 140 is fixed to the cover bottom 160 through a secondfixing tape 142 such as a double sided tape.

The middle cabinet 150 of a rectangular ring shape supports an edgeportion of the display panel 120 and protects a side surface of thedisplay panel 120. Further, the middle cabinet 150 constitutes a sideexterior of the OLED display device 110.

The display panel 120 is fixed to the middle cabinet through a firstfixing tape 152 such as a double sided tape.

The cover bottom 160 of a plate shape is disposed under the middlecabinet 150 and the inner plate 140. The cover bottom 10 can be formedof an advanced composite material (ACM) for obtain a rigidity and aradiation property.

A pattern film 154 is disposed on a first surface of the cover bottom160 corresponding to the middle cabinet 150 and the inner plate 140. TheOLED display panel 110 has an exterior of various designs and colors dueto the pattern film 154.

The PCB 170 is disposed under the cover bottom 160. The PCB 170generates a plurality of control signals and an image data using aplurality of timing signals and an image signal and transmits theplurality of control signals and the image data to an integrated circuit(IC) through a flexible printed circuit (FPC).

The integrated circuit can be mounted on the flexible printed circuit.The integrated circuit can generate a gate signal and a data signalusing the plurality of control signals and the image data and cantransmit the gate signal and the data signal to the display panel 120through the flexible printed circuit.

The PCB 170 can be fixed to the inner plate 140 through the cover bottom160. These features will be illustrated with reference to drawings.

FIGS. 3A and 3B are an exploded perspective view and a cross-sectionalview, respectively, showing an inner plate, a cover bottom and a printedcircuit board of the organic light emitting diode display deviceaccording to the first embodiment of the present disclosure.

In FIGS. 3A and 3B, the PCB 170 of the OLED display device 110 is fixedto the cover bottom 160 and the inner plate 140 using a plurality ofnuts 172 and a plurality of bolts 174.

The plurality of nuts 172 such as a PEM nut are disposed on and fixed tothe inner plate 140, and a plurality of first combining holes and aplurality of second combining holes are formed in the cover bottom 160and the PCB 170, respectively. The plurality of bolts 174 are combinedto the plurality of nuts 172 through the plurality of second combiningholes of the PCB 170 and the plurality of first combining holes of thecover bottom 160, and the PCB 170 is fixed to the inner plate 140through the cover bottom 160.

Since the second fixing tape 142 is disposed between the inner plate 140and the cover bottom 160 and a third fixing tape 162 is disposed betweenthe cover bottom 160 and the PCB 170, a combining force of the innerplate 140, the cover bottom 160 and the PCB 170 can be supplemented.

In the OLED display device 110 according to the first embodiment of thepresent disclosure, since the display panel 120 is supported by themiddle cabinet 150 and the rigidity and the radiation property of thecover bottom 160 are supplemented by the inner plate 140, the exteriorof various designs and colors of the OLED display device 110 is obtainedand the rigidity and the radiation property of the OLED display device110 are improved.

Since the display panel 120 is fixed to the middle cabinet 150 throughthe first fixing tape 152, deterioration such as a detachment can occurand attachment reliability can be reduced.

In addition, since a gap exists between the display panel 120 and thecover bottom 160, deterioration such as a crack can occur in the displaypanel 120 due to a press caused by an external pressure.

Further, the OLED display device 110 may have a design limitation suchas a gap in an edge portion due to an attachment through the firstfixing tape 152.

To remedy the above limitation, a display panel can be formed to includea protecting substrate and a printed circuit board can be directlyattached to the display panel. These features will be illustrated withreference to drawings.

FIG. 4 is an exploded perspective view showing an organic light emittingdiode display device according to a second embodiment of the presentdisclosure, and FIG. 5 is a cross-sectional view showing the organiclight emitting diode display device according to the second embodimentof the present disclosure.

In FIGS. 4 and 5, an organic light emitting diode (OLED) display device210 according to the second embodiment of the present disclosureincludes a display panel 320 and a printed circuit board (PCB) 270.

The display panel 220 includes an array substrate 222, a polarizingplate 224, a side sealing layer 226, a face sealing adhesive layer 228,a face sealing metal layer 230, a heat conductive adhesive layer 232, aprotecting substrate 234 and a pattern film 236.

The array substrate 222 displays an image using a gate signal and a datasignal, and the polarizing plate 224 prevents reflection of an externallight.

The polarizing plate 224 has a size greater than a size of the arraysubstrate 222 and is attached to a first surface of the array substrate222. The side sealing layer 226 covers a side surface of the arraysubstrate 222 and the polarizing plate 224 exposed outside the arraysubstrate 222 to block an external moisture or an external oxygenpenetrating into the array substrate 222.

The face sealing adhesive layer 228 is attached to a second surface ofthe array substrate 222, and a first surface of the face sealing metallayer 230 is attached to the face sealing adhesive layer 228. The facesealing metal layer 230 is attached to the array substrate through theface sealing adhesive layer 228.

The face sealing adhesive layer 228 and the face sealing metal layer 230block an external moisture or an external oxygen penetrating into thearray substrate 222, and the face sealing metal layer 230 maintains arigidity of the array substrate 222.

For example, the face sealing metal layer 230 can have a thickness ofabout 0.08 mm, a Young's modulus of about 148 GPa, a density of about0.291 lb/in³ and a heat conductivity of about 10.15 W/mK.

The heat conductive adhesive layer 232 is attached to a second surfaceof the face sealing metal layer 230, and a first surface of theprotecting substrate 234 is attached to the heat conductive adhesivelayer 232. The protecting substrate 234 is attached to the arraysubstrate 222 through the heat conductive adhesive layer 232.

For example, the heat conductive adhesive layer 232 can include a resinsuch as an acryl, an epoxy and a urethane. The heat conductive adhesivelayer 232 can be formed on a lower surface of the face sealing metallayer 230 through a coating method, or the heat conductive adhesivelayer 232 of a tape shape can be attached to a lower surface of the facesealing metal layer 230.

The heat conductive adhesive layer 232 can further include a heatconductive material such as a metal particle to transmit a heat of thearray substrate 222 to the protecting substrate 234.

The protecting substrate 234 radiates a heat of the array substrate 222.Specifically, the protecting substrate 234 rapidly diffuses a local heatof the array substrate 222 to improve a temperature uniformity of thedisplay panel 220.

A heat radiation property can be judged according to a maximumtemperature of nine temperatures at nine points of a display paneldisplaying an image, and a temperature uniformity can be judgedaccording to a deviation between a maximum temperature and a minimumtemperature of nine temperatures at nine points of a display paneldisplaying an image.

For example, the OLED display device 110 according to the firstembodiment can have maximum temperatures of about 73.4 degrees and about75.1 degrees when an image of a yellow box pattern having a luminance ofabout 250 nit is displayed, and the OLED display device 110 according tothe first embodiment can have maximum temperatures of about 77.2 degreesand about 74.5 degrees when an image of a yellow box pattern having aluminance of about 350 nit is displayed.

Further, the OLED display device 210 according to the second embodimentcan have maximum temperatures of about 41.4 degrees and about 41.1degrees when an image of a yellow box pattern having a luminance ofabout 250 nit is displayed, and the OLED display device 210 according tothe second embodiment can have maximum temperatures of about 42.0degrees and about 42.4 degrees when an image of a yellow box patternhaving a luminance of about 350 nit is displayed. As a result, themaximum temperature of a predetermined pattern image of the OLED displaydevice 210 according to the second embodiment is reduced by atemperature over about 30 degrees as compared with the OLED displaydevice 110 according to the first embodiment.

In example, the OLED display device 110 according to the firstembodiment can have deviations of maximum and minimum temperatures ofabout 9.8 degrees and about 18.7 degrees when an image of a full whitehaving luminances of about 250 nit and about 350 nit is displayed. TheOLED display device 210 according to the second embodiment can havedeviations of maximum and minimum temperatures of about 6.2 degrees andabout 12.1 degrees when an image of a full white having luminances ofabout 250 nit and 350 nit is displayed. As a result, the deviation ofmaximum and minimum temperatures of the OLED display device 210according to the second embodiment is reduced by a value over about 3.6degrees as compared with the OLED display device 110 according to thefirst embodiment.

Accordingly, the OLED display device 210 according to the secondembodiment has an improved heat radiation property and an improvedtemperature uniformity due to a rapid diffusion of a local heat by theheat conductive adhesive layer 232 and the protecting substrate 234 ascompared with the OLED display device 110 according to the firstembodiment.

The protecting substrate 234 can be formed of a metallic material. Forexample, the protecting substrate 230 can have a thickness over about0.50 mm, a Young's modulus of about 200 GPa and a density of about 0.282lb/in³. The protecting substrate 234 of an electro galvanized iron (EGI)can have a heat conductivity of about 52 W/mK, and the protectingsubstrate 234 of aluminum (Al) can have a heat conductivity of about 167W/mK.

The protecting substrate 234 blocks an external moisture or an externaloxygen penetrating into the array substrate 222.

The pattern film 236 is attached to a second surface of the protectingsubstrate 234. The pattern film 236 can include patterns so that anexterior of the OLED display device 210 can have various designs andcolors.

The PCB 270 is disposed under the display panel 220. The PCB 270generates a plurality of control signals and an image data using aplurality of timing signals and an image signal and transmits theplurality of control signals and the image data to an integrated circuit(IC) through a flexible printed circuit (FPC).

The integrated circuit can be mounted on the flexible printed circuit.The integrated circuit can generate a gate signal and a data signalusing the plurality of control signals and the image data and cantransmit the gate signal and the data signal to the display panel 220through the flexible printed circuit.

The PCB 270 can be fixed to the protecting substrate 234 of the displaypanel 220. These features will be illustrated with reference todrawings.

FIGS. 6A and 6B are an exploded perspective view and a cross-sectionalview, respectively, showing a protecting substrate and a printed circuitboard of the organic light emitting diode display device according tothe second embodiment of the present disclosure.

In FIGS. 6A and 6B, the PCB 270 of the OLED display device 210 is fixedto the protecting substrate 234 of the display panel 220 using aplurality of brackets 272 and a plurality of bolts 274.

The plurality of brackets 272 are disposed on and fixed to a rearsurface of the protecting substrate 234 (or the pattern film 236)through a resin layer 276, and each of the plurality of brackets 272 canhave at least two nut holes.

The PCB 270 can have a plurality of combining holes corresponding to thenut holes of the plurality of brackets 272. The plurality of bolts 274are combined to the nut holes of the plurality of brackets 272 throughthe plurality of combining holes of the PCB 270, and the PCB 270 isfixed to the protecting substrate 234 of the display panel 220.

Since the plurality of brackets 272 are fixed to the protectingsubstrate 234 using the resin layer 276 and the PCB 270 is fixed to theprotecting substrate 234 using the plurality of bolts 274, the PCB 270can be fixed to the display panel 220 without forming combining holes inthe protecting substrate 234 blocking an external moisture or anexternal oxygen.

In the OLED display device 210 according to the second embodiment of thepresent disclosure, since the protecting substrate 234 of the displaypanel 220 is formed of a metallic material, the PCB 270 is attacheddirectly to the display panel 220 without an additional frame. As aresult, an exterior of various designs and colors is obtained and arigidity is improved.

Since the array substrate 222 is attached to the protecting substrate234 through the heat conductive adhesive layer 232, deterioration suchas a detachment of the display panel 220 is prevented and an attachmentreliability is improved.

Since a gap does not exist between the array substrate 222 and theprotecting substrate 234, deterioration such as crack of the displaypanel 220 due to a press caused by an external pressure is prevented.

The OLED display device 210 has an exterior of various designs andcolors using the pattern film 236.

Since the protecting substrate 234 is formed of a metallic material andthe heat conductive adhesive layer 232 includes a material having arelatively high heat conductivity, a heat radiation property of the OLEDdisplay device 210 is improved.

In another embodiment, the face sealing metal layer 230 and the heatconductive adhesive layer 232 can be omitted. These features will beillustrated with reference to drawings.

FIG. 7 is an exploded perspective view showing an organic light emittingdiode display device according to a third embodiment of the presentdisclosure, and FIG. 8 is a cross-sectional view showing the organiclight emitting diode display device according to the third embodiment ofthe present disclosure.

In FIGS. 7 and 8, an organic light emitting diode (OLED) display device310 according to a third embodiment of the present disclosure includes adisplay panel 320 and a printed circuit board (PCB) 370.

The display panel 320 includes an array substrate 322, a polarizingplate 324, a face sealing adhesive layer 328, a side sealing layer 332,first and second pattern films 334 and 336 and a protecting substrate330.

The array substrate 322 displays an image using a gate signal and a datasignal, and the polarizing plate 324 prevents reflection of an externallight.

The polarizing plate 324 is attached to a first surface of the arraysubstrate 322, and the face sealing adhesive layer 3328 is attached to asecond surface of the array substrate 322. The face sealing adhesivelayer 328 blocks an external moisture or an external oxygen penetratinginto the array substrate 322.

The protecting substrate 330 is attached to a lower surface of the facesealing adhesive layer 328. The protecting substrate 330 maintains arigidity of the array substrate 322 and blocks an external moisture oran external oxygen penetrating into the array substrate 322.

The first and second pattern films 334 and 336 are attached to first andsecond surfaces, respectively, of the protecting substrate 330. Theprotecting substrate 330 has a size greater than the polarizing plate324, the array substrate 322 and the face sealing adhesive layer 328 andis attached to a second surface of the array substrate 322.

The side sealing layer 332 covers side surfaces of the array substrate322 and the polarizing plate 324 and a portion of the first pattern film334 exposed through the side surface of the face sealing adhesive layer328, the array substrate 322 and the polarizing plate 324 to block anexternal moisture or an external oxygen penetrating into the arraysubstrate 322.

The first and second pattern films 334 and 336 can include patterns sothat an exterior of the OLED display device 310 can have various designsand colors.

The protecting substrate 330 can be formed of a glass. For example, theprotecting substrate 330 can have a thickness over about 0.50 mm(preferably, over about 3.00 mm), a Young's modulus of about 71.5 GPaand a density of about 0.0874 lb/in³. To improve a radiation property,the first and second pattern films 334 and 336 can include a heatconductive material such as a metal particle.

Alternatively, the protecting substrate 330 can be formed of a metallicmaterial. For example, the protecting substrate 330 can have a thicknessover about 0.50 mm (preferably, over about 3.00 mm), a Young's modulusof about 200 GPa and a density of about 0.282 lb/in³. The protectingsubstrate 330 of an electro galvanized iron (EGI) can have a heatconductivity of about 52 W/mK, and the protecting substrate 330 ofaluminum (Al) can have a heat conductivity of about 167 W/mK.

When the OLED display device 310 displays images of luminances of about150 nit, about 200 nit, about 300 nit and about 400 nit, the displaypanel 320 having the protecting substrate 330 of a thickness of about0.50 mm can have minimum temperatures of about 31.5 degrees, about 36.2degrees, about 45.2 degrees and about 54.5 degrees, respectively, andthe display panel 320 having the protecting substrate 330 of a thicknessof about 2.00 mm can have minimum temperatures of about 26.7 degrees,about 30.7 degrees, about 38.3 degrees and about 46.2 degrees,respectively. Further, the display panel 320 having the protectingsubstrate 330 of a thickness of about 3.00 mm can have minimumtemperatures of about 26.2 degrees, about 30.1 degrees, about 37.5degrees and about 45.3 degrees, respectively, and the display panel 320having the protecting substrate 330 of a thickness of about 4.00 mm canhave minimum temperatures of about 26.2 degrees, about 30.1 degrees,about 37.5 degrees and about 45.3 degrees, respectively. The displaypanel 320 having the protecting substrate 330 of a thickness smallerthan about 0.50 mm can have a minimum temperature greater than about 55degrees for an image of a luminance of about 400 nit. As a result, aheat of the display panel 320 having the protecting substrate 330 of athickness greater than about 0.50 mm is radiated, and a heat of thedisplay panel 320 having the protecting substrate 330 of a thicknesssmaller than about 0.50 mm is not radiated such that elements of thedisplay panel 320 can be deteriorated.

When the protecting substrate 330 is formed of a metallic material, thefirst pattern film 334 is not recognized at a rear surface of thedisplay panel 310 and the first pattern film 334 can be omitted.

The PCB 370 is disposed under the display panel 320. The PCB 370generates a plurality of control signals and an image data using aplurality of timing signals and an image signal and transmits theplurality of control signals and the image data to an integrated circuit(IC) through a flexible printed circuit (FPC).

The integrated circuit can be mounted on the flexible printed circuit.The integrated circuit can generate a gate signal and a data signalusing the plurality of control signals and the image data and cantransmit the gate signal and the data signal to the display panel 320through the flexible printed circuit.

The PCB 370 can be fixed to the protecting substrate 330 of the displaypanel 320. These features will be illustrated with reference todrawings.

FIGS. 9A and 9B are an exploded perspective view and a cross-sectionalview, respectively, showing a protecting substrate and a printed circuitboard of the organic light emitting diode display device according tothe third embodiment of the present disclosure.

In FIGS. 9A and 9B, the PCB 370 of the OLED display device 310 is fixedto the protecting substrate 330 of the display panel 320 using aplurality of brackets 372 and a plurality of bolts 374.

The plurality of brackets 372 are disposed on and fixed to a rearsurface of the protecting substrate 330 (or the second pattern film 336)through a resin layer 376, and each of the plurality of brackets 372 canhave at least two nut holes.

The PCB 370 can have a plurality of combining holes corresponding to thenut holes of the plurality of brackets 372. The plurality of bolts 374are combined to the nut holes of the plurality of brackets 372 throughthe plurality of combining holes of the PCB 370, and the PCB 370 isfixed to the protecting substrate 330 of the display panel 320.

Since the plurality of brackets 372 are fixed to the protectingsubstrate 330 using the resin layer 376 and the PCB 370 is fixed to theprotecting substrate 330 using the plurality of bolts 374, the PCB 370can be fixed to the display panel 320 without forming combining holes inthe protecting substrate 330 blocking an external moisture or anexternal oxygen.

FIG. 10 is a cross-sectional view showing a display panel of the organiclight emitting diode display device according to the third embodiment ofthe present disclosure.

In FIG. 10, the display panel 320 includes the array substrate 322, theface sealing adhesive layer 328, the side sealing layer 332, theprotecting substrate 330 and the first and second pattern films 334 and336.

A semiconductor layer 404 is disposed in a pixel region P on the arraysubstrate 322. The semiconductor layer 404 includes an active region 404a in a central portion which includes an intrinsic silicon andconstitutes a channel, and a source region 404 b and a drain region 404c at both sides of the active region 404 a which includes silicon dopedwith impurities.

A gate insulating layer 405 is disposed on a whole of the arraysubstrate 322 having the semiconductor layer 404.

A gate electrode 407 is disposed on the gate insulating layer 405corresponding to the active region 404 a of the semiconductor layer 404,and a gate line connected to the gate electrode 407 is disposed on thegate insulating layer 405.

A first interlayer insulating layer 406 a is disposed over a whole ofthe array substrate 322 having the gate electrode 407 and the gate line.The first interlayer insulating layer 406 a and the gate insulatinglayer 405 have first and second semiconductor contact holes 409 exposingthe source region 404 b and the drain region 404 c, respectively, of thesemiconductor layer 404.

A source electrode 408 a and a drain electrode 408 b spaced apart fromeach other are disposed on the first interlayer insulating layer 406 a.The source electrode 408 a and the drain electrode 408 b are connectedto the source region 404 b and the drain region 404 c, respectively,through the first and second semiconductor contact holes 409.

A second interlayer insulating layer 406 b is disposed on the sourceelectrode 408 a, the drain electrode 408 b and the first interlayerinsulating layer 406 a exposed outside the source electrode 408 a andthe drain electrode 408 b. The second interlayer insulating layer 406 bhas a drain contact hole 412 exposing the drain electrode 408 b.

The source electrode 408 a, the drain electrode 408 b, the semiconductorlayer 404 including the source region 404 b and the drain region 404 ccontacting the source electrode 408 a and the drain electrode 408 b,respectively, the gate insulating layer 405 on the semiconductor layer404 and the gate electrode 407 constitute a driving thin film transistor(TFT) DTr.

Further, a data line crossing the gate line to define a pixel region Pis disposed on the first interlayer insulating layer 406 a, and aswitching TFT having the same structure as the driving TFT DTr isconnected to the driving TFT DTr.

While the switching TFT and the driving TFT DTr exemplarily have aco-planar type where the semiconductor layer 404 includespolycrystalline silicon in the third embodiment of FIG. 10, theswitching TFT and the driving TFT DTr can have a bottom gate type wherethe semiconductor layer includes intrinsic silicon and silicon dopedwith impurities in another embodiment.

A first electrode 411 of a material having a relatively high workfunction connected to the drain electrode 408 b of the driving TFT DTris disposed in a region where an image is displayed on the secondinterlayer insulating layer 406 b.

The first electrode 411 is disposed in each pixel region P, and a banklayer 419 is disposed between the first electrodes 411 of the adjacentpixel regions P.

The first electrode 411 is separated in each pixel region P with thebank layer 419 as a border between the adjacent pixel regions P.

A light emitting layer 413 is disposed on the first electrode 411.

The light emitting layer 413 can have a single layered structure of anemitting material or a multiple layered structure of a hole injectinglayer (HIL), a hole transporting layer (HTL), an emitting material layer(EML), an electron transporting layer (ETL) and an electron injectinglayer (EIL) for increasing an emission efficiency.

The light emitting layer 413 can emit red, green and blue coloredlights. For example, the light emitting layer 413 can include red, greenand blue light emitting layers 413 a, 413 b and 413 c.

A second electrode 415 is disposed on a whole of the array substrate 322having the light emitting layer 413.

The first electrode 411, the light emitting layer 413 and the secondelectrode 415 constitute a light emitting diode E. The first electrode411 can be one of an anode and a cathode, and the second electrode 415can be the other of an anode and a cathode.

For example, the second electrode 415 can have a double layeredstructure where a half transparent metal layer has a metallic materialhaving a relatively low work function and having a relatively smallthickness and a transparent conductive layer has a transparentconductive material having a relatively great thickness. The displaypanel 320 can be driven as a top emission type where a light of thelight emitting layer 413 is emitted through the second electrode 415.

Alternatively, the second electrode 415 can have an opaque metal layer.The display panel 320 can be driven as a bottom emission type where alight of the light emitting layer 413 is emitted through the firstelectrode 411.

When a voltage is applied to the first electrode 411 and the secondelectrode 415 according to a selected color signal, a hole from thefirst electrode 411 and an electron from the second electrode 415 aretransported to the light emitting layer 413 to constitute an exciton.When the exciton transitions from an excited state to a ground state, alight is generated to be emitted as a visible ray.

The light can be emitted through the second electrode 415 or the firstelectrode 411 to an exterior, and the display panel 320 can display animage.

The protecting substrate 330 is disposed over the driving TFT DTr andthe light emitting diode E, and the array substrate 322 and theprotecting substrate 330 are attached to each other through the facesealing adhesive layer 328 such that the display panel 320 isencapsulated.

The face sealing adhesive layer 328 prevents penetration of an externalmoisture or an external oxygen into the light emitting diode E toprotect the driving TFT DTr and the light emitting diode E on the arraysubstrate 322. The face sealing adhesive layer 328 is disposed over thearray substrate 322 to wrap the light emitting diode E.

The face sealing adhesive layer 328 can be formed of one of an opticallycleared adhesive (OCA), a heat curable resin and a heat curable sealantand can seal the driving TFT DTr and the light emitting diode E on thearray substrate 322.

The array substrate 322 can be formed of one of a glass, a plastic and ametal.

When the array substrate 322 is formed of a metal foil, the arraysubstrate 322 can have a thickness of about 100 μm. Since the arraysubstrate 322 of a metal foil has a relatively small thickness ascompared with the array substrate 322 of a glass or a rolled steelmaterial, the total thickness of the display panel 320 can be reduced.In addition, a durability of the display panel 320 can be improved evenwith the reduced total thickness.

In the OLED display device 310 according to the third embodiment of thepresent disclosure, since the protecting substrate 330 of the displaypanel 320 is formed of a glass or a metallic material having a thicknessgreater than about 3.0 mm, the PCB 370 is attached directly to thedisplay panel 320 without an additional frame. As a result, an exteriorof various designs and colors is obtained and a rigidity is improved.

Since the array substrate 322 is attached to the protecting substrate330 through the face sealing adhesive layer 328, deterioration such as adetachment of the display panel 320 is prevented and an attachmentreliability is improved.

Since a gap does not exist between the array substrate 322 and theprotecting substrate 330, deterioration such as crack of the displaypanel 320 due to a press caused by an external pressure is prevented.

The OLED display device 310 has an exterior of various designs andcolors using the first and second pattern films 334 and 336.

Since the first and second pattern films 334 and 336 on the protectingsubstrate 330 of a glass include a material having a relatively highheat conductivity or the protecting substrate 330 includes a metallicmaterial having a relatively high heat conductivity, a heat radiationproperty of the OLED display device 310 is improved.

It will be apparent to those skilled in the art that variousmodifications and variation can be made in the present invention withoutdeparting from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. An organic light emitting diode display device,comprising: a display panel including an array substrate configured todisplay an image, a face sealing adhesive layer attached to the arraysubstrate, a side sealing layer covering a side surface of the arraysubstrate, and a protecting substrate attached to the array substratethrough the face sealing adhesive layer; and a printed circuit boardattached to the protecting substrate, wherein the printed circuit boardgenerates a plurality of control signals and an image data and transmitsthe plurality of control signals and the image data to an integratedcircuit, wherein the integrated circuit generates a gate signal and adata signal using the plurality of control signals and the image dataand transmits the gate signal and the data signal to the display panel,and wherein the face sealing adhesive layer is attached to a whole of asurface of the array substrate.
 2. The organic light emitting diodedisplay device of claim 1, wherein the display panel further includes: aface sealing metal layer under the face sealing adhesive layer, and aheat conductive adhesive layer under the face sealing metal layer. 3.The organic light emitting diode display device of claim 2, wherein theprotecting substrate includes a metallic material, and wherein a patternfilm is disposed on the protecting substrate.
 4. The organic lightemitting diode display device of claim 2, where the heat conductiveadhesive layer includes a resin and a heat conductive material.
 5. Theorganic light emitting diode display device of claim 1, wherein theprotecting substrate has a thickness greater than approximately 0.50 mm.6. The organic light emitting diode display device of claim 5, whereinthe protecting substrate includes a glass, wherein first and secondpattern film are disposed on both sides, respectively, of the protectingsubstrate, and wherein the first pattern film includes a metal particle.7. The organic light emitting diode display device of claim 5, whereinthe protecting substrate includes a metallic material, and wherein afirst pattern film is disposed on the protecting substrate.
 8. Theorganic light emitting diode display device of claim 1, furthercomprising a plurality of brackets fixed to the protecting substratethrough a resin layer.
 9. The organic light emitting diode displaydevice of claim 1, wherein the array substrate includes a switching thinfilm transistor, a driving thin film transistor connected to theswitching thin film transistor and a light emitting diode connected tothe driving thin film transistor.
 10. An organic light emitting diodedisplay device, comprising: a display panel including an array substrateconfigured to display an image, a face sealing adhesive layer attachedto the array substrate, a side sealing layer covering a side surface ofthe array substrate, and a protecting substrate attached to the arraysubstrate through the face sealing adhesive layer; a printed circuitboard attached to the protecting substrate; and a plurality of bracketsfixed to the protecting substrate through a resin layer, wherein each ofthe plurality of brackets has at least two nut holes, wherein theprinted circuit board has a plurality of combining holes correspondingto the at least two nut holes of the plurality of brackets, and whereinthe printed circuit board is fixed to the protecting substrate bycombining a plurality of bolts to the at least two nut holes of theplurality of brackets through the plurality of combining holes of theprinted circuit board.